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Solution for COG/FOG/FOF/FOB Bonding foreign object inspection

A foreign object detection solution based on visual and image processing technology, as an important means of product quality control, is mainly used before or after the COG/FOG process of LCD screens to detect defects such as foreign objects, corrosion, and scratches, and avoid defective products flowing out of the next process.

Solution Features

Optical+Algorithm
Independent intellectual property micro level high-precision high-speed optical imaging system, which eliminates interference from dust and micro particles on the top layer of the LCD screen to ensure imaging quality;

The core algorithm for defect detection with proprietary intellectual property rights and AI deep learning re evaluation algorithm are at the forefront of the industry.
Fast laser autofocus+high-speed motion stable working platform

Innovatively adopting an I-shaped seismic scanning mechanism and a marble seismic platform to achieve stable operation;

Adopting fast laser autofocus, it is not afraid of detecting object warping and deformation.
Original backend automatic report analysis system
Visualize data backup and data traceability, automatically implement image classification, facilitate user queries and audits;

Original backend automatic report analysis system, realizing report output and providing users with quick submission of problem solutions.
Meet personalized needs
Programming is simple, fast, easy to configure, and a fast secondary development platform that can meet the personalized needs of different customers.

Recommended solution

TFT-LCD online foreign object line inspection machine

TFT-LCD online foreign object line inspection machine is an AOI equipment used to detect product defects before and after bonding of LCD panels. It mainly detects foreign objects, corrosion, scratches and other defects, thereby improving production line yield and the manufacturer's process control capabilities.

FPC flexible circuit board bonding foreign object inspection machine

The FPC flexible circuit board bonding foreign object inspection machine is used to detect defects such as FPC misalignment, bubbles, various foreign objects, and missing particles after FPC bonding. Using an array camera for double-sided shooting, taking defective images, extracting defects through software algorithms, designing different software algorithms for processing and classification according to different defects, and adjusting detection specifications based on algorithm thresholds. Real time monitoring of the bonding quality of the production line, equipment alarms remind employees to handle batch defects in a timely manner, greatly reducing the occurrence of defective products and preventing them from flowing to the next post.

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