Bonding testing

The FPC flexible circuit board bonding foreign object inspection machine is used to detect defects such as FPC misalignment, bubbles, various foreign objects, and missing particles after FPC bonding. Using an array camera for double-sided shooting, taking defective images, extracting defects through software algorithms, designing different software algorithms for processing and classification according to different defects, and adjusting detection specifications based on algorithm thresholds. Real time monitoring of the bonding quality of the production line, equipment alarms remind employees to handle batch defects in a timely manner, greatly reducing the occurrence of defective products and preventing them from flowing to the next post.